Director of Functional Safety
10:40 AM Scene Setting | From Semiconductor Components to ISO 26262 Compliant Functionally Safe Systems
This presentation will begin by describing how to apply the ISO 26262-11:2018 standard for both semiconductor components developed as part of a compliant item as well as an SEooC. The presenters will then discuss
• How (during Functional Safety Analysis), the semiconductor component is divided into parts, subparts and elementary subparts
• What (and why), is the necessary and sufficient analysis technique?
• HW failure modes and how they relate to both HW faults and errors
• Failure modes, fault models and techniques to distribute base fail rates will be outlined
A case study that tackles mixed-signal fault injection and failure mode distributions will be presented. Finally, a method to leverage component safety analysis to the design and production of functionally safe systems is described.
4:10 PM Panel Discussion | Expectations by Tier 1 & OEM – How a successful corporation could look like
This panel discussion serves as an exchange of ideas between semiconductor companies, Tier 1 and OEM in order to discuss challenges and successes in their corporation. Ideas of improvement will be discussed and different views on the inter-work will be given.