The ISO 26262 standard for functional safety in automotive E/E systems so far did not provide clear instructions for semiconductor companies. The freshly added part 11 is dedicated only to the semiconductor industry and aims d closing big gaps. Due to its novelty, part 11 offers quiet a lot of discussion potential on how to interpret and apply it. This panel will address the most important issues.
• The great achievement – Learn to read ISO 26262 part 11
• Application challenges and how to best overcome them
• FMEDA and FTA – Should they stay or should they go now?
10:40 AM Scene Setting | From Semiconductor Components to ISO 26262 Compliant Functionally Safe Systems
This presentation will begin by describing how to apply the ISO 26262-11:2018 standard for both semiconductor components developed as part of a compliant item as well as an SEooC. The presenters will then discuss
• How (during Functional Safety Analysis), the semiconductor component is divided into parts, subparts and elementary subparts
• What (and why), is the necessary and sufficient analysis technique?
• HW failure modes and how they relate to both HW faults and errors
• Failure modes, fault models and techniques to distribute base fail rates will be outlined
A case study that tackles mixed-signal fault injection and failure mode distributions will be presented. Finally, a method to leverage component safety analysis to the design and production of functionally safe systems is described.